Inter-Die Gapfill Tool Expands Industry-Leading Portfolio of Solutions for 3D Integration and Chiplet Technologies; Paves Way for New, AI-Accelerating Architectures "VECTOR TEOS 3D deposits the ...
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Lam Research launches VECTOR TEOS 3D tool
Lam Research (LRCX) “unveiled VECTOR(R) TEOS 3D, a breakthrough deposition tool engineered specifically for the advanced packaging of next-generation chips required for artificial intelligence and ...
Inter-Die Gapfill Tool Expands Industry-Leading Portfolio of Solutions for 3D Integration and Chiplet Technologies; Paves Way for New, AI-Accelerating Architectures Addresses Manufacturing Pain ...
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