A SPICE model based on the BSIM3 core eliminates shortcomings in the existing level 1 and level 3 subcircuit models, enabling better simulation of trench-type power MOSFETs. An improved SPICE model ...
Santa Clara, Calif. — Agilent Technologies announced the shipment of the BSIM3 model extraction package that cuts CMOS extraction time to two days, from an industry standard 10 days. Designed for use ...
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