Extensive Array of Back-End and Advanced Packaging Wet Wafer Process Equipment Leverages ACM’s Experience to Address Emerging Requirements for Wafer-Level Packaging FREMONT, Calif., Oct. 15, 2020 ...
SAN JOSE — WaferMasters Inc. has developed a family of annealing ovens capable of taking up to five semiconductor wafers of 150-mm, 200-mm or 300-mm diameter. The Stacked Annealing Oven (SAO) is ...
Semitool Inc. has secured a multiple system order of its Millenium 300mm single wafer processor from a Japanese semiconductor development consortium. The unnamed organization is made up of several ...
Rapidus on Friday announced that it had begun prototyping of test wafers with 2nm gate-all-around (GAA) transistor structures at its IIM-1 facility in Japan. The company confirmed that early test ...
As demand for device slips below 0.18m m, are relying more machinable help get silicon wafers through the fab line quickly with less consumable costs and fewer defects per wafer. OEMs and fabs want to ...
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