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Atomic-scale chip alignment: Laser holograms could set new standard for 3D semiconductor overlay accuracy
Scientists at the University of Massachusetts Amherst have introduced a novel method for aligning layers in chips using lasers and metalenses. The new technique is claimed to achieve accuracy down to ...
Trimble introduced today the Spectra Precision LT56 Universal Laser Layout Tool at the World of Concrete exhibition in Las Vegas. The LT56 is an easy-to-use, automatic self-leveling laser that ...
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