Tesla has been granted a patent for a multi-chip module design featuring a Redistribution Layer substrate with IC dies mounted on both surfaces, sockets, and a cold plate. The innovative mounting ...
In a research note today, Apple supply chain analyst Ming-Chi Kuo suggested that MacBook Pro models with M5 chips might not launch until 2026. Kuo discussed how the A20 chips in iPhone 18 models will ...
Qorvo, Inc. has launched three new highly integrated RF multi-chip modules (MCMs) designed for advanced radar applications. Leveraging Qorvo’s advanced packaging and process technology, the QPF5001, ...
A new technical paper titled “MCMComm: Hardware-Software Co-Optimization for End-to-End Communication in Multi-Chip-Modules” was published by researchers at Georgia Tech. “Increasing AI computing ...
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