Multi-die designs are gaining broader adoption in a wide variety of end applications, including high-performance computing, artificial intelligence (AI), automotive, and mobile. Despite clear ...
In recent years there has been a sharp rise of multi-die system designs. Numerous publications targeting a large variety of applications exist in the public domain. One presentation [2] on the IEEE’s ...
This application note presents thermal considerations for QFN package integrated circuits. It presents the QFN/PCB thermal structure, the optimization of thermal flag interface, the conduction paths ...
The U.S. Defense Advanced Research Projects Agency (DARPA) Microsystems Technology Office is soliciting research proposals for the development of a new class of atom-based systems using integrated ...
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