PCBAIR announced the launch of its advanced 8-layer Glass Core PCB manufacturing capabilities, combining proprietary Through Glass Via (TGV) technology with multi-layer redistribution layers (RDL).

As silicon technology advances to enable higher density ASICs, the core logic voltage decreases. The lower voltage, in combination with higher current requirements, requires tighter tolerances on the ...

We wonder if [Carl Bugeja] was looking at a 3D printer’s heated bed when he got the idea to create a PCB reflow heater using a PCB. He tried a quick test to heat up a standard PCB and made it ...

The ScanWorks platform for embedded instruments from ASSET InterTech is a validation and test platform which supports Intel’s second generation Core processors (formerly codenamed Sandy Bridge).

Amid rising US-China tech tensions, Taiwan-based PCB suppliers have accelerated factory expansions in Southeast Asia since 2022. However, despite new PCB clusters reaching full production, most PCBs ...

Designed for AI accelerators, high-speed data center servers, and optical transceivers, PCBAIR's 8-layer Glass Core PCBs support finer line widths and spacing, with pilot production and customer ...