Three independent design processes – chip, package, and PCB – are typically required for the latest electronic products which utilize increasingly complex systems on chip (SoCs) and multiple chips in ...

Surface-mount technology (SMT) is evolving far beyond its roots as a way of assembling packaged chips onto printed circuit boards without through-holes. It is now moving inside packages that will ...

Last month’s column talked about a simpler way to exchange stackups with manufacturing partners. This month, continuing the ...

Eventually, almost every EE must design a PCB, which isn’t something that’s taught in school. Yet engineers, technicians, and even novice PCB designers can create high-quality PCBs for any and every ...

For many applications, next generation IC packaging is the best path to achieve silicon scaling, functional density, and heterogeneous integration while reducing the overall package size.

Advanced packaging continues to promise improved form factor, cost, performance, and functionality compared to the traditional transistor scaling on SoCs. This is done by integrating multiple dies on ...

[Hans Rosenberg] knows a thing or two about RF PCB design and has provided a three-part four-part video demonstration of some solid rules of thumb. We will cover the first part here and leave the ...

When analyzing the supply and demand of global semiconductor design talents in 2021, one finds US-based companies to be the main source of chip design demand. US-based companies accounted for 43% of ...