Arteris, Inc. has announced the launch of Magillem Packaging, a new software aimed at simplifying and accelerating the chip design process, particularly for advanced technologies in AI and edge ...

For decades, packaging design has been a painstaking process, with designers and brands having to juggle multiple complex tools to complete just a single project. The outcome has often been riddled ...

As a leading supplier of automotive semiconductors, STMicroelectronics must continue to move fast to develop and deliver leading-edge solutions. Employing package design as part of system innovation ...

Why should there be an interest in Package Assembly Design Kits (PADK) today? For the most part, it is due to the advancement in the accumulation of files forming the PADK now offering a customized ...

AI packaging tools provider Pacdora is preparing to introduce a comprehensive AI-powered solution for design and marketing to transform the packaging creation process. With more than six million users ...

Members can download this article in PDF format. Today, advances in semiconductors and ICs are producing ever smaller and denser circuits. With that comes the challenge of efficiently packaging and ...

SINGAPORE, Aug. 29, 2025 /PRNewswire/ -- Today, Pacdora, a fast-growing packaging design platform, is looking ahead and sharing its vision for a fully AI-powered, end-to-end solution for design and ...