Defect detection requirements on the order of 10 defective parts per million (DPPM) are driving improvements in inspection tools’ resolution and throughput at foundries and OSATs. However, defects ...

Full-blown process excursions that affect every wafer are comparatively easy for fabs to detect and fix. However, “onesie-twosie,” lower-volume excursions can go unresolved for months or even years.

The testing of the semiconductor dies produced by a wafer fabrication plant involves a long series of operations requiring meticulous care. The time spent performing these tests markedly affects both ...

ATR spectroscopy is a surface-sensitive method of infrared sampling, which is commonly used in the analysis of thin films and monolayers on surfaces. Areas that require this approach include the ...