There are two golden rules to thermal design: start simple and start early. The heat-flow path from the junction to the ambient, usually air in the local environment, determines a component’s ...
In a previous article, “A Close Look at Facts and Myths About Thermal Vias,” we used a thermal simulation model called Thermal Risk Management, or TRM, to model thermal vias. Thermal vias, almost by ...
Joule heating, also known as resistive or Ohmic heating, is the power lost to heat as electrical current flows down a conductor. We were introduced to Joule’s first law (Power dissipation = I²R, VI, ...
Fig 1. The die pad in Texas Instruments’ PowerPAD supports the die during fabrication, thus serving as a good thermal heat path to remove the heat away from the chip. Fig 2. TI’s PowerStack 3D ...
Pulsonix, the industry-leading PCB design software from WestDev Ltd, has announced a major enhancement to its design ecosystem: a direct interface between Pulsonix and ADAM Research's TRM (Thermal ...
The simulation tracks a satellite's surface and internal temperature changes as it orbits Earth, considering varying thermal inputs from sunlight and Earth's shadow. Monte Carlo radiation modeling ...
Throughout the electronics industry, submicron feature size at the die level are driving package component sizes down to the design-rule level of the early technologies. Today’s integrated circuit (IC ...
Consumer electronics – tablets, smartphones and e-readers – is now leading the industry in growth. For system manufacturers and integrated circuit (IC) suppliers, the challenge involves keeping pace ...
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