Several equipment makers are ramping up new inspection equipment to address the growing defect challenges in IC packaging. At one time, finding defects in packaging was relatively straightforward. But ...

CHARLOTTE, N.C. — The IC design and test community's quest to achieve fewer than 100 defective parts per million (DPPM) is becoming more difficult as process technologies move below 100 nanometers.

Wire bonding is widely used in electronic devices, the semiconductor industry, and microelectronics. It enables interconnections between the die and other electronic components in an integrated ...