Cleaving is a simple yet rapid method used to prepare samples of silicon and other semiconductor materials; however, despite being a single crystal material, sapphire does not cleave well. Existing ...

Improving on product overlay is one of the key challenges when shrinking technology nodes in semiconductor manufacturing. . . . With smart placement of alignment mark pairs in the X and Y direction, ...

Cleaving is a fast and simple technique used for preparing samples of silicon and other semiconductor materials; however, sapphire, despite being a single crystal material, does not cleave well.

Since its formation in December 2010, the SEMI 3DS-IC Standards Committee has made significant progress in establishing key standards in areas such as TSV metrology, glass carrier wafers, and ...

Cleaving is a fast and simple method used for preparing samples of semiconductor materials, including silicon. In contrast, sapphire does not cleave well, despite being a single crystal. While sawing ...

Laser Photonics initiated R&D for laser solutions in pharmaceuticals, semiconductors, and wafer technologies. New efforts leverage Control Micro Systems' tech for tablet drilling, wafer scribing, and ...

A high-speed laser scribing method based on a 266nm source can cut 20% more LEDs per wafer, says JPSA. Front scribing using a 266 nm source rather than a conventional 355 nm laser is helping ...

An optical method for mask alignment in double-sided lithography has been developed by a team at the University of Hagen in Germany (Appl. Opt. 40 5052). The technique, which is based on the ...