IGBT failures are often caused by gap-types defects in or among the materials bonded to create the module. The defects may be voids, delaminations, disbonds, or may involve the tilting of a layer, ...
Developed by Malaysian scientists, the proposed multi-level aluminum fin heat sinks (MLFHS) were found able to reduce the module operating temperature by up to 8.45 degrees Celsius and increase power ...
When choosing an effective heat sink, engineers usually consider its price, size, weight, performance and other features. But equal care should be given to deciding how the heat sink will be attached ...
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