CES 2026 showcases the latest AI-powered devices and systems, from vision chips for automotive to sensing solutions for AI ...

CDNS teams up with Lightmatter to advance co-packaged optics, pairing SerDes and UCIe IP with silicon photonics to meet AI ...

Taiwan Semiconductor Manufacturing Company (TSM), or TSMC, is the world’s largest and most advanced semiconductor foundry.

Hardware-based security; 3D-IC challenges, opportunities; resource-constrained graphics; silicon photonics; edge AI speech ...

The Global Electronics Association has published a new international standard, IPC‑6921, for organic IC substrates.

GlobalLogic Inc., a Hitachi Group Company and a leader in Digital Engineering, today announced a major strategic expansion of ...

To support its digital sovereignty goals, the European Union has invested heavily in cutting-edge RISC-V research and development through the Chips Joint Undertaking (CHIPS JU), which funds projects ...

Following the freezing of the JEDEC LPDDR6 standard in 2024, Innosilicon Technology swiftly delivered to its key clients within just a few months and has been continuously aligning with updates to the ...

This close partnership will focus on high-performance computing, software-defined vehicle platforms, and global market enablementSANTA CLARA, Calif, Jan 23, 2026 - (JCN Newswire) - GlobalLogic Inc., a ...

Cantor Fitzgerald initiates Strategy as overweight Cantor said in its initiation of Strategy that the crypto company is ready ...

In January 2026, Cadence unveiled its new Chiplet Spec-to-Packaged Parts ecosystem, aimed at simplifying engineering and ...

Hardware Root of Trust in the Quantum Computing Era: How PUF-PQC Solves PPA Challenges for SoCs ...