Abstract: This work presents a VCO-based capacitance sensing circuit aimed at large area electrowetting on dielectric (EWOD) arrays in thin-film transistor (TFT) technology. The proposed solution can ...
Abstract: Thermomechanical stress induced by through-silicon vias (TSVs) plays an important role in the performance and reliability analysis of 2.5D/3D ICs. While the finite element method (FEM) ...
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