The code can improve itself, but humans will still be responsible for understanding why something changed and whether it ...
Abstract: In this study, the thermal characteristics and structure reliability during power cycling for the four types of SiC power module fabricated using a SiC-heater chip, direct bonded aluminum ...
Abstract: With the continuous increase in heat flux of high-power chip modules, the resulting rise in chip junction temperature poses a substantial threat to the longevity and reliability of power ...
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