Mini LED chips can measure as small as 50μm × 100μm, with pad spacing as narrow as 5-50μm, demanding extreme precision in ...

Abstract: Die attach process is widely used to realize the connection between die, device and the rest of the system in electronic packaging. During this process, the die moves under the capillary ...

Abstract: This paper presents a new numerical model to characterize the die attach process in the advance packaging. With its successful application on a 5 mm by 5 mm with 70um thickness die attached ...

When a multi-die package worth $500 fails final test because of a defect that originated three process steps earlier, the economics of advanced packaging become painfully clear. Each excursion carries ...

In the semiconductor industry, the outsourced semiconductor assembly and test (OSAT) sector plays a pivotal role in the global technology landscape. As the backbone of electronic device manufacturing, ...

Indium Corporation will feature its high-reliability, gold (Au)-based precision die-attach preforms for critical laser and radio frequency (RF) applications, as well as 5G communications, at the IEEE ...

The DA-5045-2 and DA-5045-4 high-thermal-conductivity die-attach adhesives for attaching LEDs and small die are engineered to withstand JEDEC level 1/ 260°C reliability standards in LED packaging ...